Journey of Limitless Creativity —
| Item | Capability | Details |
|---|---|---|
| Aluminium | Maximum finished size | 610 mm × 1200 mm |
| Final board thickness | 0.5 mm – 5.0 mm | |
| Board thickness tolerance | +/-10% | |
| Copper Thickness | 0.5 oz – 10 oz | |
| Warp and Twist | ≤ 0.75% | |
| Thermal Conductivity | 1 W – 3 W | 1 W/(m·K), 1.5 W/(m·K), 2 W/(m·K), 3 W/(m·K) |
| Minimum Trace Width | 0.2 mm | 0.2 mm |
| Minimum Line Space | 0.2 mm | 0.2 mm |
| Profile | Punching profile tolerance | ±0.13 mm |
| Routing profile tolerance | ±0.1 mm | |
| Conductors & outline tolerance | ±0.15 mm | |
| V - cut | V-cut angle | 30 ± 5° |
| Tolerance of remain thickness | ±0.1 mm | |
| V-cut dimension tolerance | ±0.13 mm | |
| Groove width | ≤ 0.5 mm | |
| Groove to groove | ≥ 20 mm | |
| Groove to trace | ≥ 0.45 mm | |
| Surface Finish | Lead free HASL thickness | 1–40 μm |
| Au thickness of Immersion Au | 1–5 u" | |
| Ni thickness of Immersion Au | 80–200 u" | |
| Solder mask registration tolerance | ±0.05 mm | |
| Solder mask thickness | ≥ 10 μm | |
| Solder mask line width | ≥ 0.1 mm | |
| Line to solder PAD | 0.1 mm | |
| Solder PAD to solder PAD | 0.2 mm | |
| Hole | Minimum drilled hole size | 0.5 mm |
| Drilling hole diameter Tolerance | ±0.075 mm | |
| Hole position tolerance (first) | ±0.06 mm | |
| Hole position tolerance (second) | ±0.12 mm | |
| Hole edge to hole edge | ≥ 0.15 mm | |
| Hole edge to circuit | ≥ 0.2 mm |